How we win
High-performance Laser Drivers (LDs) and Transimpedance Amplifiers (TIAs) for next-generation optical transceivers support high-speed data center connectivity across a broad range of optical architectures.
Ultra-low-power LDs and TIAs optimized for linear optical architectures, enabling high-speed connectivity with reduced reliance on power-hungry DSPs.
High-performance analog equalizers for high-speed copper interconnects, delivering ultra-low power and sub-100ps latency for AI/ML data center applications.
GainCore is Semtech's high-power indium phosphide gain chip family. It provides the building blocks for coherent optical transport links and scale-across networks, delivering the optical gain needed as data center architectures scale.
LambdaCore and PhotoCore enable high-speed optical connectivity across the transmit and receive sides of the link, working hand in hand to support data center architectures as they scale.
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Semtech operates in the high-performance analog connectivity layer that helps move data between compute resources. Its technologies support both copper and optical links, helping amplify, condition, transmit, and receive high-speed signals while addressing the power and signal-integrity challenges created by increasingly complex AI infrastructure.
FiberEdge and DirectEdge address high-speed optical connectivity, including technologies used to transmit and receive data over fiber. CopperEdge addresses high-speed electrical connectivity, using technologies like linear redrivers to help maintain signal integrity across copper links.
GainCore provides key building blocks for coherent optical transport links in scale-across networks.
LambdaCore and PhotoCore enable intra-data center high-speed optical connectivity with high-performance photonic devices.
Semtech has built a diverse portfolio that covers evolving connectivity needs in AI infrastructure.
Semtech combines decades of specialized, high-speed analog expertise with an increasingly customer-driven development model. The company focuses on solving difficult connectivity problems around bandwidth, power, and signal integrity, while customers in the design phase to develop technologies that emerging architectures require.